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面板與觸控貼合模組在市場拓展之研究 = The Touch Panel ...

CAI , JI-FENG

面板與觸控貼合模組在市場拓展之研究 = The Touch Panel and Display Panel Bounding Module in the Market Development of Feasibility Study

[NT 42944] Record Type:	[NT 1579] Language materials, printed : [NT 40817] monographic
[NT 47350] Paralel Title:	The Touch Panel and Display Panel Bounding Module in the Market Development of Feasibility Study
[NT 47261] Author:	蔡其峰,
[NT 47351] Place of Publication:	新北市
[NT 47263] Published:	撰者;
[NT 47352] Year of Publication:	2016[民105]
[NT 47264] Description:	viii,75面圖表 : 30公分;
[NT 47266] Subject:	觸控面板
[NT 47266] Subject:	台灣面板廠
[NT 47266] Subject:	貼合技術
[NT 47266] Subject:	touch pannel
[NT 47266] Subject:	TFT displa
[NT 47266] Subject:	optical bonding
[NT 51458] Online resource:	http://handle.ncl.edu.tw/11296/ndltd/29598559948800144757
[NT 47265] Notes:	畢業學年度：104

面板與觸控貼合模組在市場拓展之研究 = The Touch Panel and Display Panel Bounding Module in the Market Development of Feasibility Study
蔡, 其峰

面板與觸控貼合模組在市場拓展之研究 = The Touch Panel and Display Panel Bounding Module in the Market Development of Feasibility Study / 蔡其峰撰 - 新北市 : 撰者, 2016[民105]. - viii,75面 ; 圖表 ; 30公分.
畢業學年度：104.
含參考書目.
觸控面板台灣面板廠貼合技術touch pannelTFT displaoptical bonding

面板與觸控貼合模組在市場拓展之研究 = The Touch Panel and Display Panel Bounding Module in the Market Development of Feasibility Study
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328 $a 碩士論文--醒吾科技大學行銷與流通管理系 104 $u Thesis (M.B.A.) -- Hsing Wu University of Institution of Marketing and Distribution Management, 2016
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